■ 제품필수정보

제조사	Bergquist
제조사품명	HF625-0.005-AC-104
간략설명	Thermal Interface Pad, Hi-Flow 625, 0.5W/m·K, 25 x 19mm 0.127mm, Self-Adhesive

■ 제품사양

크기 = 25 x 19mm Thickness = 0.127mm Length = 25mm Width = 19mm Thermal Conductivity = 0.5W/m·K Material = Hi-Flow 625 Self-Adhesive = Yes
최소 작동 온도 = -30°C
최대 작동 온도 = +150°C Material Trade Name = Hi-Flow 625 Operating Temperature Range = -30 ??+150 °C HI-FLOW phase change product. The HI-FLOW flexible replaces thermal grease. Flexible substrate on aluminium with thermal conduction properties equivalent to those of thermal grease without its drawbacks during production. HI-FLOW 625 provides excellent thermal contact between 2 surfaces and insulation up to 4,000 V. Products available in dry version (DRY terminals or terminals with one face coated with thermal acrylic adhesive for easy positioning (AC terminals)